GKG GT++ Fully Automatic Solder Paste Printer Used / New
product detail
Optional functions
- Bottle-type automatic tinning and solder paste detection function
- Mobile automatic solder paste addition to ensure solder paste quality and solder paste amount in steel mesh, thereby ensuring customer printing quality and improving productivity.
- Automatic glue dispensing system
- According to different printing process requirements, after printing, the PCB board can be accurately dispensed, tinned, line drawn, filled and other functions; at the same time, the glue dispensing head is also equipped with a heating function, which can heat the glue when the ambient temperature is low to improve the fluidity of the glue.
- SPI connection
- Connected with SPI to form a closed-loop system. When receiving feedback information about poor printing from SPI, the machine will automatically adjust according to the SPI feedback offset. The XY direction offset can be automatically adjusted within 3PCS, and the steel mesh will be cleaned to improve printing quality and production efficiency, forming a complete printing feedback system.
- Steel mesh detection function
- By performing light source compensation above the steel mesh, using CCD to check the mesh of the steel mesh in real time, it can quickly detect and determine whether the steel mesh is blocked after cleaning, and automatically clean it, which is a supplement to the 2D detection of the PCB board.
- Leading the compatibility of Industry 4.0
- By automatically uploading or outputting the machine status and parameters, it provides strong guarantees for the intelligent production of Industry 4.0 for customers. It can achieve seamless docking with the customer's MES system and achieve high traceability of products; intelligently control equipment maintenance, and realize self-allocation of usage rights for engineers at all levels according to on-site management.
- BTB
- Double tracks bring twice the performance: the two devices can be controlled separately, for example running different products on each track; the two devices can be separated again at any time.
Specifications
Model |
GT++ |
Screen frame size |
470×370-737×737mm |
Substrate size |
50×50—510×510mm |
Substrate thickness |
0.4-6mm |
Substrate weight |
5Kg |
Substrate edge gap |
2.5mm |
Transmission height |
23mm |
Transmission height |
900±40mm |
Transport speed |
1500mm/S (MAX) Software control (speed adjustable) |
Transmission method |
One-stage transport guide rail |
Substrate support method |
Magnetic ejector pin/equal height block/automatic adjustment of lifting platform |
Substrate clamping method |
Automatic telescopic upper pressure plate/flexible clamping edge/vacuum adsorption function |
Printing demolding |
0-20mm |
Printing mode |
Single or double scraper printing |
Scraper type |
Rubber scraper/steel scraper (angle 45°/55°/60°) |
Scraper speed |
6-200mm/sec |
Printing pressure |
0.5-10Kg |
Cleaning method |
Drip cleaning system/reciprocating cleaning/dry and wet vacuum modes |
Field of view |
10×8mm |
Reference point type |
Standard reference point/pad/opening |
Camera type |
Visual system with up and down imaging/digital camera/geometric matching positioning |
System alignment accuracy and repeatability |
±12.5um@6σ, CPK≥2.0 |
Actual solder paste placement repeatability |
±18um@6σ, CPK≥2.0 |
Printing cycle |
<7.5sec |
Power requirement |
AC220V±10%,50/60Hz,3KW |
Compressed air requirement |
4-6Kgf/cm² |
Air consumption About |
5L/min |
Working environment temperature |
﹣20℃~﹢45℃ |
Working environment humidity |
30%~60% |
Dimensions (excluding three-color light) |
L1240×W1410×H1500 (mm) |
Weight |
About 1100Kg |