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HS60- PARMI 3D SPI Solder Paste Inspection Machine Used
HS60
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HS60- PARMI 3D SPI Solder Paste Inspection Machine Used

Description

PARMI SPI HS60 features a number of advanced technologies, including intelligent SMT vision, place-and-test (PnT) technology, and intelligent robot feeding. It is equipped with three sets of nozzles, two of which are used for SMT nozzle mounting and one for vision registration. The system is equipped with an auto-focus laser head for optimal pin registration accuracy.

SPI HS60 asset is capable of high-volume production, with a maximum board size of 10' x 10'. It is an extremely versatile machine, capable of processing various parts, such as BGA and CSPs, as well as lead-free solders. In addition, it features an optimized chip module, which allows for high-speed chip mounting. This ability, along with its other features, makes this model perfect for PCB assembly and manufacturing tasks for small- to medium-scale projects.

    product detail

    Specifications

    SPI Series

    HS60 Series

    HS70 Series

    HS70DH

    3D Camera

    Sensor Head

    RSC5

    (Supreme) RSC6-HS

    RSC6-HS

    RSC6-HR

    RSC6-HSx2

     

    Scan Speed (sq.cm/sec)

    60

    100

    100

    80

    100

     

    X,Y Resolution(um)

    18x18

    13x13

    13x13

    10x10

    13x13

     

    Lateral Length (mm)

    23

    32

    32

    22

    32

     

    Height Resolution(um)

    0.2

    0.2

    02

    0.1

    02

    Performance

    Repeatability

    3 Sigma<lum/Height
    3Sigma<1%/Volume
    3Sigma<1%/Area

    3 Sigma<lum/Height
    3Sigma<1%/Volume
    3Sigma<1%/Area

    3 Sigma<lum/Height
    3Sigma<1%/Volume
    3Sigma<1%/Area

    3 Sigma<lum/Height
    3Sigma<1%/Volume
    3Sigma<1%/Area

    3 Sigma<lum/Height
    3Sigma<1%/Volume
    3Sigma<1%/Area

     

    Accuracy(um/Height)

    2

    2

    2

    2

    2

     

    Gage R&R

    <<10%/0402-1608 chip

    <<10%/0402-1608 chip

    <<10%/0402-1608 chip

    <<10%/0402-1608 chip

    <<10%/0402-1608 chip

    Measurement

    Min.Solder Paste Size(um)

    200×200

    150x150

    150x150

    100x100

    150x150

     

    Max.Solder Paste Size(um)

    20x20

    20×20

    20×20

    20×20

    20x20

     

    Min.Solder Paste Pitch(um)

    100

    100

    100

    80um

    100

     

    Max.Solder Paste Height(um)

    1000um

     

    Measurement ltem

    Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

    Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

    Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

    Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

    Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

     

    PCB Warpage

    ±5mm(2%)

    ±5mm(2%)

    ±5mm(2%)

    ±5mm(2%)

    ±5mm(2%)

    Board
    Dmension

    Min Size(L*W)

    H860,60L: 50×50
    H860D: 80×80
    HS60XL,60XXL:100x100

    HS60, 60L Supreme.50×50
    HS60D Plus.8DX80
    HS60XL Supreme:100x100

    HS70:80×80
    HS70L, HS70XL:100x100

    80×80

    80×80

     

    Max Size
    (L*W)

    HS60: 360×260
    HS60L: 520×510
    HS60XL: 700×510
    HS60XXL: 880X510
    HS60D: 340×315

    HS60 Supreme: 340x260
    HS60L Supreme: 500x510
    HS60XL Supeme: 685x510
    HS60D Plus: 350x315

    HS70D: 420×350
    HS70L: 590×610
    HS70XL: 950×670

    HS70D: 340×315
    HS70DL: 590×610

    350×250

     

    Thickness

    0.4mm to 4mm

     

    TOP/Bottom
    Clearance
    (mm/mm)

    HS60: 25/25
    HS60L,60XL,60XXL: 18/25
    HS60d: 4/23

    HS60 Supreme: 25/25
    HS60L, 60XL.Supreme: 25/25
    HS60D Plus: 4/23

    0

    4/23

    4/20

     

    TOP/Bottom
    Edge Clearance
    (mm/mm)

    HS60, 60L, 60XL: 2.5/3.5
    HS60XXL: 3.5/4.5
    HS60D: 25/3.5

    HS60, 60L, 60XL Supreme: 2.5/3.5
    HS60D Plus: 2.5/3.5

    HS70, 70L: 2.5/3.5
    HS70XL: 3.5/5.0

    HS70D, 70DL: 2.5/3.5

    2.5/4.0

     

    PCB Weight(kg)

    HS60: 2
    HS60L, 60XL, 60XXL: 4
    HS60D:1.5

    HS70: 2
    HS70L,70XL: 10
    HS70D: 1.5
    H870DL: 3

    1.5

    Computer&
    Console

    CPU

    Intel i3-2100(3.1G)

    Intel i3-2100(3.1G)

    Intel i3-2100(3.1G)

    Intel i3-2100(3.1G)

    Intel i3-2100(3.1G)

     

    Memory(GB)

    HS60, HS60L: 8
    HS60XL, HS60XXL: 16

    8

    HS70: 8
    HS70L: 16
    HS70XL: 48

    16

    8

     

    Monitor

    20*Wide

     

    OperatingSystem

    MS-Windows XP Professional 64bit/Window 7

    Utility

    Power(kw)

    AC 220V (50/60Hz, 1 Phase)

     

     

    HS60:1.5
    HS60L, H60XL ,HS60XXL: 1.8

    2.3

    HS70: 1.7
    HS70L: 1.8
    HS70XL: 2.0

    2.3

    3.5

     

    Air

    5Kgf/sq.cm

    System
    Dimension

    Dimension
    (W*D*H)mm

    HS60: 900x1000xl480
    HS60L: 1060x1285x1480
    HS60XL: 1240x1285x1430
    HS60XXL: 1420×1285×1480
    HS60D: 1180x1395×1480

    HS60 Supereme: 900x1000x1480
    HS60L Supereme: 1060x1285x1450
    HS60XL Supereme :1240x1285x1480
    HS60D Plus: 1180x1435×1450

    HS70: 970x1195x1535
    HS70L: 1170x1335x1535
    HS70XL: 1530x1415x1535

    HS70D 1:920x1415x1510
    HS70D 3:1180x1475x1510

    1296x1980x1510

     

    Weight(kg)

    HS60: 750
    HS60L, 60XL, 60XXL:1000
    HS60D: 900

    HS60 Supereme: 750
    HS60L, 60XL, 60XXL Supereme:1000
    HS60D Plus: 900

    HS70:800
    HS70L: 950
    HS70XL: 1100

    900

    1000

    Options             Height Gauge{Calibration Jig}, 1D 2D Barcode System,Closed Loop System