HS60- PARMI 3D SPI Solder Paste Inspection Machine Used
product detail
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Specifications |
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SPI Series |
HS60 Series |
HS70 Series |
HS70DH |
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3D Camera |
Sensor Head |
RSC5 |
(Supreme) RSC6-HS |
RSC6-HS |
RSC6-HR |
RSC6-HSx2 |
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Scan Speed (sq.cm/sec) |
60 |
100 |
100 |
80 |
100 |
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X,Y Resolution(um) |
18x18 |
13x13 |
13x13 |
10x10 |
13x13 |
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Lateral Length (mm) |
23 |
32 |
32 |
22 |
32 |
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Height Resolution(um) |
0.2 |
0.2 |
02 |
0.1 |
02 |
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Performance |
Repeatability |
3 Sigma<lum/Height |
3 Sigma<lum/Height |
3 Sigma<lum/Height |
3 Sigma<lum/Height |
3 Sigma<lum/Height |
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Accuracy(um/Height) |
2 |
2 |
2 |
2 |
2 |
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Gage R&R |
<<10%/0402-1608 chip |
<<10%/0402-1608 chip |
<<10%/0402-1608 chip |
<<10%/0402-1608 chip |
<<10%/0402-1608 chip |
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Measurement |
Min.Solder Paste Size(um) |
200×200 |
150x150 |
150x150 |
100x100 |
150x150 |
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Max.Solder Paste Size(um) |
20x20 |
20×20 |
20×20 |
20×20 |
20x20 |
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Min.Solder Paste Pitch(um) |
100 |
100 |
100 |
80um |
100 |
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Max.Solder Paste Height(um) |
1000um |
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Measurement ltem |
Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink |
Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink |
Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink |
Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink |
Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink |
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PCB Warpage |
±5mm(2%) |
±5mm(2%) |
±5mm(2%) |
±5mm(2%) |
±5mm(2%) |
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Board |
Min Size(L*W) |
H860,60L: 50×50 |
HS60, 60L Supreme.50×50 |
HS70:80×80 |
80×80 |
80×80 |
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Max Size |
HS60: 360×260 |
HS60 Supreme: 340x260 |
HS70D: 420×350 |
HS70D: 340×315 |
350×250 |
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Thickness |
0.4mm to 4mm |
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TOP/Bottom |
HS60: 25/25 |
HS60 Supreme: 25/25 |
0 |
4/23 |
4/20 |
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TOP/Bottom |
HS60, 60L, 60XL: 2.5/3.5 |
HS60, 60L, 60XL Supreme: 2.5/3.5 |
HS70, 70L: 2.5/3.5 |
HS70D, 70DL: 2.5/3.5 |
2.5/4.0 |
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PCB Weight(kg) |
HS60: 2 |
HS70: 2 |
1.5 |
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Computer& |
CPU |
Intel i3-2100(3.1G) |
Intel i3-2100(3.1G) |
Intel i3-2100(3.1G) |
Intel i3-2100(3.1G) |
Intel i3-2100(3.1G) |
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Memory(GB) |
HS60, HS60L: 8 |
8 |
HS70: 8 |
16 |
8 |
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Monitor |
20*Wide |
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OperatingSystem |
MS-Windows XP Professional 64bit/Window 7 |
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Utility |
Power(kw) |
AC 220V (50/60Hz, 1 Phase) |
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HS60:1.5 |
2.3 |
HS70: 1.7 |
2.3 |
3.5 |
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Air |
5Kgf/sq.cm |
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System |
Dimension |
HS60: 900x1000xl480 |
HS60 Supereme: 900x1000x1480 |
HS70: 970x1195x1535 |
HS70D 1:920x1415x1510 |
1296x1980x1510 |
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Weight(kg) |
HS60: 750 |
HS60 Supereme: 750 |
HS70:800 |
900 |
1000 |
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Options Height Gauge{Calibration Jig}, 1D 2D Barcode System,Closed Loop System |
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