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HS60

HS60

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HS60- PARMI 3D SPI Solder Paste Inspection Machine Used

2024-09-20

Description

PARMI SPI HS60 features a number of advanced technologies, including intelligent SMT vision, place-and-test (PnT) technology, and intelligent robot feeding. It is equipped with three sets of nozzles, two of which are used for SMT nozzle mounting and one for vision registration. The system is equipped with an auto-focus laser head for optimal pin registration accuracy.

SPI HS60 asset is capable of high-volume production, with a maximum board size of 10' x 10'. It is an extremely versatile machine, capable of processing various parts, such as BGA and CSPs, as well as lead-free solders. In addition, it features an optimized chip module, which allows for high-speed chip mounting. This ability, along with its other features, makes this model perfect for PCB assembly and manufacturing tasks for small- to medium-scale projects.

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