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NPM-W2 - Panasonic Modular Chip Mounter

NPM-W2

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NPM-W2 - Panasonic Modular Chip Mounter

Introduction:

 The NPM-W2 amplifies the original NPM-W capabilities with a 10% throughput boost and 25% more accuracy. It also integrates new innovations like our incomparable Multi Recognition Camera. Combined, these features extend the component range down to the 03015mm microchip, yet preserve capability up to 120x90mm components up to 40mm tall and nearly 6” long (150mm) connectors.

Featuring a revolutionary Multi Recognition Camera that uniquely combines three separate imaging capabilities into a single system: 2D alignment, component thickness inspection, and 3D coplanarity measurement. 

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    Product Detail

    product detail

    Features

    • Higher productivity and quality with printing, placement and inspection process integration
    • For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm
    • Higher area productivity through dual lane placement
    • Quick-change feeder carts and nozzle banks
    • Lightweight 16-nozzle head (for 77,000 CPH) with increased placement accuracy to 25um (cpk ≥ 1.0)

     

    Model

    Panasonic NPM W2 Pick and Place Machine

    PCB Dimension (mm)

    Single lane*1

    Batch mounting

    L 50 x W 50 ~ L 750 x W 550

    2-positin mounting

    L 50 x W 50 ~ L 350 x W 550

    Dual-lane*2

    Dual transfer (Batch)

    L 50 × W 50 ~ L 750 × W 260

    Dual transfer (2-positin)

    L 50 × W 50 ~ L 350 × W 260

    Single transfer (Batch)

    L 50 × W 50 ~ L 750 × W 510

    Single transfer (2-positin)

    L 50 × W 50 ~ L 350 × W 510

    Electric source

    3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kw

    Pneumatic source *2

    0.5 MPa, 200 L /min (A.N.R.)

    Dimensions *2 (mm)

    1280*3x2332*4×1444 *5

    Mass

    2 470 kg

    Placement head

    Lightweight 16-nozzle head
    (Per head)

    12-nozzle head
    (Per head)

    Lightweight 8-nozzle head (Per head)

    3-nozzle head V2
    (Per head)

    High production mode [ON]

    High production mode [OFF]

    High production mode [ON]

    High production mode [OFF]

    Max. speed

    38 500cph
    (0.094 s/ chip)

    35 000cph
    (0.103 s/ chip)

    32 250cph
    (0.112 s/ chip)

    31 250cph
    (0.115 s/ chip)

    20 800cph
    (0.173 s/ chip)

    8 320cph
    (0.433 s/ chip)
    6 500cph
    (0.554 s/ QFP)

    Placement accuracy
    (Cpk1)

    ±40 μm / chip

    ±30 μm / chip
    (±25μm / chip)*6

    ±40 μm / chip

    ±30 μm / chip

    ± 30 µm/chip
    ± 30 µm/QFP
    12mm
    to 32mm
    ± 50 µm/QFP
    12mm Under

    ± 30 µm/QFP

    Component
    dimensions
    (mm)

    0402*7 chip ~ L 6 x W 6 x T 3

    03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3

    0402*7 chip ~ L 12 x W 12 x T 6.5

    0402*7 chip ~ L 32 x W 32 x T 12

    0603 chip to L 150 x W 25 (diagonal152) x T 30

    Component
    supply

    Taping

    Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm

    Tape : 4 to 56 mm

    Tape : 4 to 56 / 72 / 88 / 104 mm

    Max.120 (Tape: 4, 8 mm)

    Front/rear feeder cart specifications : Max.120
    ( Tape width and feeder are subject to the conditions on the left)
    Single tray specifications : Max.86
    ( Tape width and feeder are subject to the conditions on the left)
    Twin tray specifications : Max.60
    ( Tape width and feeder are subject to the conditions on the left)

    Stick

    Front/rear feeder cart specifications :
    Max.30 (Single stick feeder)
    Single tray specifications :
    Max.21 (Single stick feeder)
    Twin tray specifications :
    Max.15 (Single stick feeder)

    Tray

    Single tray specifications : Max.20
    Twin tray specifications : Max.40