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Sigma X - PARMI Dual Laser 3D SPI Machine Used/ New

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Sigma X - PARMI Dual Laser 3D SPI Machine Used/ New

Description

3D Parmi’s SigmaX solder paste inspection system provides innovative, industry-leading performance to add value to your business.The latest in measurement technology, coupled with the industry’s fastest cycle times and unique process support tools, maximizes your return on investment and your profit.

  • Dual laser technology eliminates shadowing.
  • Compatible with all PCB colors, finishes and HASLs.
  • Identifies all features, including bores, vias, board edge and crimps.
  • Inspection speed of 100?/sec at 10×10 micron resolution, as well as immediate access to results, provides the best performance in the industry.
  • High respectability and accuracy with height measurements of +/- 1mm

    product detail

    RSCVII 3D sensor features.

    • Inspection speed increased by 25~30% with respect to the RSCVI.
    • Sigma X: 100?/sec at 10×10 microns
    • Sigma X Blue: 60?/sec at 10×10 microns. Real-time measurement and control of plate buckling.
    • Real 3D shape and 2D image.

    Sigma X specifications and dimensions.

     

     

     

     

     

    W

    900

    970

    850

    950

    D

    1000

    1195

    1205

    1365

    H

    1480

    1535

    1510

    1510

    Max size

    360 X 260

    420 X 350

    480 X 350

    580 X 510

     

    • Maximizing plate size with minimum plant usage.
    • The SigmaX offers a wide range of features, including machine intelligence focused on identifying and eliminating defects at their root cause.
    • Process analysis tools, powerful Statistical Process Control utilities, and closed-loop communications to processes up and down the line, all designed to solve problems and make your life easier.
    • Parmi systems are synonymous with high quality design, materials and workmanship. Only the highest quality components have been included in the SigmaX. All sub-systems are accessible for easy maintenance.