SPI

Description

3D Parmi’s SigmaX solder paste inspection system provides innovative, industry-leading performance to add value to your business.The latest in measurement technology, coupled with the industry’s fastest cycle times and unique process support tools, maximizes your return on investment and your profit.

• Dual laser technology eliminates shadowing.
• Compatible with all PCB colors, finishes and HASLs.
• Identifies all features, including bores, vias, board edge and crimps.
• Inspection speed of 100?/sec at 10×10 micron resolution, as well as immediate access to results, provides the best performance in the industry.
• High respectability and accuracy with height measurements of +/- 1mm

Description

PARMI SPI HS60 features a number of advanced technologies, including intelligent SMT vision, place-and-test (PnT) technology, and intelligent robot feeding. It is equipped with three sets of nozzles, two of which are used for SMT nozzle mounting and one for vision registration. The system is equipped with an auto-focus laser head for optimal pin registration accuracy.

SPI HS60 asset is capable of high-volume production, with a maximum board size of 10' x 10'. It is an extremely versatile machine, capable of processing various parts, such as BGA and CSPs, as well as lead-free solders. In addition, it features an optimized chip module, which allows for high-speed chip mounting. This ability, along with its other features, makes this model perfect for PCB assembly and manufacturing tasks for small- to medium-scale projects.