Inspection Machine

X-7900 electronic semiconductor testing equipment can be used to detect integrated circuit chip semiconductors, such as BGA, IGBT, flip chip and PCBA component welding, high-precision testing in LED, photovoltaic, radiator and other industries;

Widely used in industrial manufacturing fields, such as automotive parts, casting testing,pressure vessel and pipeline welding quality testing, and new material analysis;

It can detect defects in various types of batteries, such as power batteries, cylinders, flexible packaging, square cases and laminates, etc.

General-purpose, non-destructive testing system

Routers, electronic components, LED materials

Lithium batteries, aerospace

The X-7100 Inspection machine launched has a wide range of applications. It is commonly used in the internal structure testing of electronic components, bubbles, void rate measurement, short-circuit and open circuit, missing solder joints, missing solder, foreign matter cracks inside, etc.

It has the characteristics of easy maintenance and long service life; simple operation, reducing operator training; high detection repeatability; and allowing a maximum viewing angle of 60 degrees to detect samples.

Transmission, non-destructive testing

Semiconductor packaging, automotive industry, LED bonding, lithium battery, PCBA

X-9200 electronic semiconductor testing equipment, with a minimum detection accuracy of 1um, can be used to detect integrated circuit chip semiconductors, such as BGA, IGBT, flip chip and PCBA component welding, LED bonding, IC packaging and other industries for high-precision testing.

The X-160T-M equipment can effectively target the current manufacturing industry, the problems of aluminum casting products, such as cracks, shrinkage, porosity, trachoma or other internal defects of aluminum casting, the above defects may cause great losses to their end users, such as causing product failure to be delivered. At present, the market of aluminum castings is steadily growing, especially for some production-critical safety parts, for the need of production safety and product quality assurance, it is necessary to use X-Ray NDT equipment to detect the good and bad of aluminum castings.

Description

3D Parmi’s SigmaX solder paste inspection system provides innovative, industry-leading performance to add value to your business.The latest in measurement technology, coupled with the industry’s fastest cycle times and unique process support tools, maximizes your return on investment and your profit.

• Dual laser technology eliminates shadowing.
• Compatible with all PCB colors, finishes and HASLs.
• Identifies all features, including bores, vias, board edge and crimps.
• Inspection speed of 100?/sec at 10×10 micron resolution, as well as immediate access to results, provides the best performance in the industry.
• High respectability and accuracy with height measurements of +/- 1mm

Description

PARMI SPI HS60 features a number of advanced technologies, including intelligent SMT vision, place-and-test (PnT) technology, and intelligent robot feeding. It is equipped with three sets of nozzles, two of which are used for SMT nozzle mounting and one for vision registration. The system is equipped with an auto-focus laser head for optimal pin registration accuracy.

SPI HS60 asset is capable of high-volume production, with a maximum board size of 10' x 10'. It is an extremely versatile machine, capable of processing various parts, such as BGA and CSPs, as well as lead-free solders. In addition, it features an optimized chip module, which allows for high-speed chip mounting. This ability, along with its other features, makes this model perfect for PCB assembly and manufacturing tasks for small- to medium-scale projects.

Description
3D AOI Sensor Head (TRSC-I)
• High Speed CMOS Camera (4Mega-pixel) with Dual Laser Technology
• RGB LED Lights
• Telecentric Lens
• Light Weight, Compact Sensor Head Design
• Industry Leading Inspection Speed: 65 cm2/sec @ 14 x 14um
• Cycle Time: For PCB 260mm x 200mm = 10 seconds including load and unload

This equipment is used for online automated inspection of coating process glue in production lines.